SUNON Serves as the Top Brand for Thermal Solutions Worldwide
SUNON has been in the thermal management field for various applications for over 40 years, equipping with experience in heat dissipation and problem solving in professional ways. SUNON is involved in the development of advanced liquid cooling technology that extends its product range of thermal solutions.



Generative AI technology leads to the need for higher-effectiveness servers and chipset operations that require higher CPU and GPU computational power. Liquid cooling technology has become the best solution to the issue of server overheating and high power use in response to the growth of computational capacity. SUNON innovative liquid cooling solutions are designed through a process of testing and evaluation via technical software and analytic equipment, exclusively suitable for supercomputing and HPC server applications. We also provide a set of comprehensive services, including cooling simulation, module structure, configuration costs, and in-application testing. By collaborating with clients, SUNON offers highly effective cooling technology that can not only maintain the operation of modern data centers with efficiency but also fulfill clients' needs for achieving sustainability and power-saving design.


Benefits of SUNON Customized Liquid Cooling Solutions

● Maintaining precise thermal management in an eco-friendly and power-saving condition, resulting in reduced power use by up to 80% and enhanced power usage effectiveness.
● Reducing 40% of fan noise due to its vibrations, lowering maintenance costs, and improving the safety and reliability of data centers.
● Achieving higher cooling effectiveness, resulting in enhanced server operation without computational latency, and ultimately reducing a data center’s total cost of ownership (TCO) in the long run.



SUNON Customized Liquid Cooling Solutions to New Gen Data Center Applications
Liquid cooling technology is mainly divided into two categories: direct liquid cooling and immersion cooling. Liquid has such excellent heat conductivity that it can quickly carry away the system heat by either pumping liquid into the heat centers (direst cooling) or by soaking the chassis where the heat is in liquid (immersion cooling). These solutions are designed based on the structures of specific applications to create a unique thermal contact between the surfaces of chips and cold plates and the flow between pipes and manifolds, where the liquid carries the heat generated from the chips out of the chassis and then sends it away to an in-rack cooling distribution units (CDUs) or outdoor cooling tower to cool down; after that, the liquid can be reused and pumped into the cooling systems. The repeated cooling cycle enables data centers to maintain a lower temperature and preserve power as well.

SUNON Custom-designed Liquid Cooling Solutions
Immersion Cooling
Immersion cooling is an extremely complex and customized design that costs a significant amount to set up. The advanced solutions are appropriate for high-density, high-power-consumption servers, like supercomputers or GPU clusters. Data centers can achieve an ideal PUE value (below 1.1) by reducing the amount of non-operational power used by immersion cooling, which has advantages like temperature uniformity, reduced noise, and dust-free operation.

Adhering to the SUNON Green Process enables SUNON to promptly assess the energy consumption and cooling capacity of each client's data centers. We subsequently set up specially-crafted liquid cooling systems using top-notch simulation tests, taking into account the thermal requirements and server architectures of each individual. Data centers can benefit from a synergistic effect of reduced power consumption and increased AI computational capacity with the efficacious and reliable immersion cooling solutions offered by SUNON.

>Direct Liquid Cooling
In order to adequately cool thousands of rack servers, direct liquid cooling systems need a thorough and sophisticated design appropriate for large-scale data centers. Furthermore, each rack's cooling systems are able to precisely detect temperature changes and modify the flow and supply of coolant in order to quickly remove the heat produced by the chips.Leading the way in thermal management, SUNON works with application clients with a range of thermal requirements to create cooling designs that meet higher standards and support features like I2C and redundant designs, resolving heat problems in applications with clever design and efficiency.

 Open Loop

 Closed Loop

 Reservoir and Pumping Unit(RPU)

 Cold Plates

 Water Pump

 Radiator

 Heat Exchanger